Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035211 | Integrated circuit package system with support structure under wire-in-film adhesive | WonJun Ko, JoungUn Park | 2011-10-11 |
| 7892072 | Method for directional grinding on backside of a semiconductor wafer | Sungyoon Lee, Junghoon Shin | 2011-02-22 |