Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067275 | Integrated circuit package system with package integration | Jong Wook Ju, SeungYong Chai, Taeg Ki Lim, Ja Eun Yun | 2011-11-29 |
| 8035211 | Integrated circuit package system with support structure under wire-in-film adhesive | BoHan Yoon, JoungUn Park | 2011-10-11 |
| 8022538 | Base package system for integrated circuit package stacking and method of manufacture thereof | NamJu Cho | 2011-09-20 |