Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035211 | Integrated circuit package system with support structure under wire-in-film adhesive | WonJun Ko, BoHan Yoon | 2011-10-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035211 | Integrated circuit package system with support structure under wire-in-film adhesive | WonJun Ko, BoHan Yoon | 2011-10-11 |