Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035235 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Ki Youn Jang, HeeJo Chi | 2011-10-11 |
| 8022538 | Base package system for integrated circuit package stacking and method of manufacture thereof | WonJun Ko | 2011-09-20 |
| 8018034 | Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure | HeeJo Chi, HanGil Shin | 2011-09-13 |
| 7928552 | Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2011-04-19 |
| 7863735 | Integrated circuit packaging system with a tiered substrate package and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2011-01-04 |