Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035235 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | HeeJo Chi, NamJu Cho | 2011-10-11 |
| 8018040 | Shielded stacked integrated circuit packaging system and method of manufacture thereof | Youngmin Kim, Hyung Jun Jeon | 2011-09-13 |
| 7986047 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Chul-Sik Kim, Rajendra D. Pendse | 2011-07-26 |
| 7909233 | Method of manufacturing a semiconductor package with fine pitch lead fingers | Hun Teak Lee, Jong Kook Kim, ChulSik Kim | 2011-03-22 |