Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076232 | Semiconductor device and method of forming composite bump-on-lead interconnection | — | 2011-12-13 |
| 8026128 | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask | — | 2011-09-27 |
| 7994626 | Multi-layer semiconductor package with vertical connectors and method of manufacture thereof | — | 2011-08-09 |
| 7994636 | Flip chip interconnection structure | — | 2011-08-09 |
| 7986047 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Chul-Sik Kim, Ki Youn Jang | 2011-07-26 |
| 7973406 | Bump-on-lead flip chip interconnection | — | 2011-07-05 |
| 7901983 | Bump-on-lead flip chip interconnection | — | 2011-03-08 |
| 7868468 | Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates | Byung Joon Han, HunTeak Lee | 2011-01-11 |