Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039384 | Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces | Reza A. Pagaila, KiYoun Jang | 2011-10-18 |
| 7868468 | Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates | Rajendra D. Pendse, Byung Joon Han | 2011-01-11 |