Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8050047 | Integrated circuit package system with flexible substrate and recessed package | Seng Guan Chow, Il Kwon Shim, Kambhampati Ramakrishna | 2011-11-01 |
| 8031475 | Integrated circuit package system with flexible substrate and mounded package | Seng Guan Chow, Il Kwon Shim, Kambhampati Ramakrishna | 2011-10-04 |
| 8021924 | Encapsulant cavity integrated circuit package system and method of fabrication thereof | Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow | 2011-09-20 |
| 7969023 | Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof | Taeg Ki Lim, JaEun Yun | 2011-06-28 |
| 7880293 | Wafer integrated with permanent carrier and method therefor | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Kock Liang Heng | 2011-02-01 |
| 7868468 | Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates | Rajendra D. Pendse, HunTeak Lee | 2011-01-11 |