Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8050047 | Integrated circuit package system with flexible substrate and recessed package | Seng Guan Chow, Il Kwon Shim, Byung Joon Han | 2011-11-01 |
| 8031475 | Integrated circuit package system with flexible substrate and mounded package | Seng Guan Chow, Il Kwon Shim, Byung Joon Han | 2011-10-04 |
| 8021924 | Encapsulant cavity integrated circuit package system and method of fabrication thereof | Il Kwon Shim, Byung Joon Han, Seng Guan Chow | 2011-09-20 |
| 7863730 | Array-molded package heat spreader and fabrication method therefor | Il Kwon Shim, Diane Sahakian, Seng Guan Chow, Dario S. Filoteo, Jr., Virgil Ararao | 2011-01-04 |