Issued Patents 2011
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084849 | Integrated circuit package system with offset stacking | Linda Pei Ee Chua, Heap Hoe Kuan | 2011-12-27 |
| 8084302 | Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor | Byung Tai Do, Heap Hoe Kuan, Linda Pei Ee Chua, Rui Huang | 2011-12-27 |
| 8080885 | Integrated circuit packaging system with multi level contact and method of manufacture thereof | Heap Hoe Kuan, Rui Huang | 2011-12-20 |
| 8072059 | Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die | Il Kwon Shim, Yaojian Lin, Rui Huang | 2011-12-06 |
| 8067832 | Embedded integrated circuit package system and method of manufacture thereof | You Yang Ong, Dioscoro A. Merilo | 2011-11-29 |
| 8062929 | Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die | Byung Tai Do, Heap Hoe Kuan | 2011-11-22 |
| 8050047 | Integrated circuit package system with flexible substrate and recessed package | Il Kwon Shim, Byung Joon Han, Kambhampati Ramakrishna | 2011-11-01 |
| 8049314 | Integrated circuit package system with insulator over circuitry | Byung Tai Do, Heap Hoe Kuan, Linda Pei Ee Chua, Rui Huang | 2011-11-01 |
| 8039303 | Method of forming stress relief layer between die and interconnect structure | Il Kwon Shim, Yaojian Lin | 2011-10-18 |
| 8039311 | Leadless semiconductor chip carrier system | Heap Hoe Kuan, Rui Huang | 2011-10-18 |
| 8034661 | Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP | Yaojian Lin, Il Kwon Shim | 2011-10-11 |
| 8031475 | Integrated circuit package system with flexible substrate and mounded package | Il Kwon Shim, Byung Joon Han, Kambhampati Ramakrishna | 2011-10-04 |
| 8021924 | Encapsulant cavity integrated circuit package system and method of fabrication thereof | Il Kwon Shim, Byung Joon Han, Kambhampati Ramakrishna | 2011-09-20 |
| 8004095 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | II Kwon Shim, Yaojian Lin | 2011-08-23 |
| 7993941 | Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant | Rui Huang, Il Kwon Shim, Heap Hoe Kuan | 2011-08-09 |
| 7989270 | Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors | Rui Huang, Heap Hoe Kuan, Yaojian Lin | 2011-08-02 |
| 7989269 | Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof | Byung Tai Do, Heap Hoe Kuan, Linda Pei Ee Chua, Rui Huang | 2011-08-02 |
| 7986032 | Semiconductor package system with substrate having different bondable heights at lead finger tips | Ming Ying, II Kwon Shim, Lip Seng Tan | 2011-07-26 |
| 7985628 | Integrated circuit package system with interconnect lock | Heap Hoe Kuan, Linda Pei Ee Chua, Dioscoro A. Merilo | 2011-07-26 |
| 7986043 | Integrated circuit package on package system | Dioscoro A. Merilo, Antonio B. Dimaano, Jr., Heap Hoe Kuan, Tsz Yin Ho | 2011-07-26 |
| 7981702 | Integrated circuit package in package system | Tsz Yin Ho, Dioscoro A. Merilo, Antonio B. Dimaano, Jr., Heap Hoe Kuan | 2011-07-19 |
| 7968377 | Integrated circuit protruding pad package system | Ming Ying, Il Kwon Shim, Roger Emigh | 2011-06-28 |
| 7960816 | Semiconductor package with passive device integration | Il Kwon Shim, Ming Ying, Byung Hoon Ahn | 2011-06-14 |
| 7952211 | Semiconductor assembly with component pads attached on die back side | Francis Heap Hoe Kuan | 2011-05-31 |
| 7939368 | Wafer level chip scale package system with a thermal dissipation structure | Byung Tai Do, Heap Hoe Kuan | 2011-05-10 |