Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7986043 | Integrated circuit package on package system | Dioscoro A. Merilo, Seng Guan Chow, Heap Hoe Kuan, Tsz Yin Ho | 2011-07-26 |
| 7981702 | Integrated circuit package in package system | Tsz Yin Ho, Dioscoro A. Merilo, Seng Guan Chow, Heap Hoe Kuan | 2011-07-19 |
| 7936055 | Integrated circuit package system with interlock | Pandi C. Marimuthu | 2011-05-03 |
| 7928540 | Integrated circuit package system | Il Kwon Shim, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2011-04-19 |
| 7892894 | Method of manufacturing integrated circuit package system with warp-free chip | Byung Tai Do, Il Kwon Shim, Heap Hoe Kuan | 2011-02-22 |
| 7863108 | Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof | Il Kwon Shim, Sheila Rima C. Magno | 2011-01-04 |