Issued Patents 2011
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084302 | Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor | Seng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua, Rui Huang | 2011-12-27 |
| 8080882 | Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device | Heap Hoe Kuan, Reza A. Pagaila, Linda Pei Ee Chua | 2011-12-20 |
| 8076757 | Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference | Reza A. Pagaila, Yaojian Lin, Rui Huang | 2011-12-13 |
| 8072079 | Through hole vias at saw streets including protrusions or recesses for interconnection | Reza A. Pagaila, Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2011-12-06 |
| 8067271 | Integrated circuit package system with encapsulation lock | Sung Uk Yang | 2011-11-29 |
| 8062929 | Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die | Heap Hoe Kuan, Seng Guan Chow | 2011-11-22 |
| 8063477 | Integrated circuit packaging system having asymmetric encapsulation structures and method of manufacture thereof | Reza A. Pagaila, Linda Pei Ee Chua | 2011-11-22 |
| 8048776 | Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps | Heap Hoe Kuan, Yaojian Lin, Rui Huang | 2011-11-01 |
| 8049314 | Integrated circuit package system with insulator over circuitry | Seng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua, Rui Huang | 2011-11-01 |
| 8030136 | Semiconductor device and method of conforming conductive vias between insulating layers in saw streets | Reza A. Pagaila, Linda Pei Ee Chua | 2011-10-04 |
| 8026127 | Integrated circuit package system with slotted die paddle and method of manufacture thereof | Linda Pei Ee Chua | 2011-09-27 |
| 8021923 | Semiconductor package having through-hole vias on saw streets formed with partial saw | Heap Hoe Kuan, Linda Pei Ee Chua | 2011-09-20 |
| 8021907 | Method and apparatus for thermally enhanced semiconductor package | Reza A. Pagaila, Zigmund Ramirez Camacho | 2011-09-20 |
| 8017521 | Semiconductor package having through-hole vias on saw streets formed with partial saw | Heap Hoe Kuan, Linda Pei Ee Chua | 2011-09-13 |
| 8018041 | Integrated circuit package system with offset stacked die | Heap Hoe Kuan | 2011-09-13 |
| 8017501 | Semiconductor package having through-hole vias on saw streets formed with partial saw | Heap Hoe Kuan, Linda Pei Ee Chua | 2011-09-13 |
| 8003445 | Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof | Reza A. Pagaila, Linda Pei Ee Chua | 2011-08-23 |
| 8003443 | Non-leaded integrated circuit package system with multiple ground sites | Jeffrey D. Punzalan, Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2011-08-23 |
| 7993979 | Leadless package system having external contacts | Linda Pei Ee Chua, Heap Hoe Kuan | 2011-08-09 |
| 7993976 | Semiconductor device and method of forming conductive vias with trench in saw street | Reza A. Pagaila | 2011-08-09 |
| 7994624 | Integrated circuit package system with adhesive segment spacer | Linda Pei Ee Chua, Reza A. Pagaila | 2011-08-09 |
| 7989269 | Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof | Seng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua, Rui Huang | 2011-08-02 |
| 7977802 | Integrated circuit packaging system with stacked die and method of manufacture thereof | Reza A. Pagaila, Linda Pei Ee Chua | 2011-07-12 |
| 7968996 | Integrated circuit package system with supported stacked die | Heap Hoe Kuan | 2011-06-28 |
| 7968979 | Integrated circuit package system with conformal shielding and method of manufacture thereof | Reza A. Pagaila, Linda Pei Ee Chua | 2011-06-28 |