Issued Patents 2011
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076757 | Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference | Reza A. Pagaila, Byung Tai Do, Rui Huang | 2011-12-13 |
| 8072059 | Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die | Il Kwon Shim, Seng Guan Chow, Rui Huang | 2011-12-06 |
| 8048776 | Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps | Byung Tai Do, Heap Hoe Kuan, Rui Huang | 2011-11-01 |
| 8039960 | Solder bump with inner core pillar in semiconductor package | — | 2011-10-18 |
| 8039303 | Method of forming stress relief layer between die and interconnect structure | Il Kwon Shim, Seng Guan Chow | 2011-10-18 |
| 8034661 | Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP | Il Kwon Shim, Seng Guan Chow | 2011-10-11 |
| 8026593 | Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof | Haijing Cao, Qing Zhang | 2011-09-27 |
| 8008770 | Integrated circuit package system with bump pad | Romeo Emmanuel P. Alvarez, Haijing Cao, Wan Lay Looi | 2011-08-30 |
| 8004095 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | II Kwon Shim, Seng Guan Chow | 2011-08-23 |
| 7993972 | Wafer level die integration and method therefor | Haijing Cao | 2011-08-09 |
| 7989270 | Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors | Rui Huang, Heap Hoe Kuan, Seng Guan Chow | 2011-08-02 |
| 7989356 | Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability | Xusheng Bao, Tae Hoan Jang | 2011-08-02 |
| 7968445 | Semiconductor package with passivation island for reducing stress on solder bumps | Xu Sheng Bao | 2011-06-28 |
| 7955942 | Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame | Reza A. Pagaila | 2011-06-07 |
| 7951663 | Semiconductor device and method of forming IPD structure using smooth conductive layer and bottom-side conductive layer | — | 2011-05-31 |
| 7935570 | Semiconductor device and method of embedding integrated passive devices into the package electrically interconnected using conductive pillars | Jianmin Fang, Kang Chen, Haijing Cao | 2011-05-03 |
| 7923295 | Semiconductor device and method of forming the device using sacrificial carrier | Il Kwon Shim, Seng Guan Chow | 2011-04-12 |
| 7906839 | Semiconductor device and method of shunt test measurement for passive circuits | Robert C. Frye, Kai Liu | 2011-03-15 |
| 7863706 | Circuit system with circuit element | — | 2011-01-04 |