Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062932 | Compact semiconductor package with integrated bypass capacitor and method | Francois Hebert | 2011-11-22 |
| 8053874 | Semiconductor package having a bridge plate connection | Ming Sun, Lei Shi | 2011-11-08 |
| 8035458 | Semiconductor device and method of integrating balun and RF coupler on a common substrate | Robert C. Frye | 2011-10-11 |
| 7951651 | Dual flat non-leaded semiconductor package | Xiaotian Zhang, Ming Sun, Leeshawn Luo | 2011-05-31 |
| 7906839 | Semiconductor device and method of shunt test measurement for passive circuits | Robert C. Frye, Yaojian Lin | 2011-03-15 |
| 7906375 | Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates | Ming Sun | 2011-03-15 |
| 7897438 | Method of making semiconductor package with plated connection | Leeshawn Luo, Ming Sun, Xiao Zhang | 2011-03-01 |
| 7892858 | Semiconductor package with stacked semiconductor die each having IPD and method of reducing mutual inductive coupling by providing selectable vertical and lateral separation between IPD | Robert C. Frye | 2011-02-22 |
| 7884469 | Semiconductor package having a bridged plate interconnection | Lei Shi, Ming Sun | 2011-02-08 |