Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067822 | Integrated circuit package for semiconductor devices with improved electric resistance and inductance | Anup Bhalla, Yueh-Se Ho, Sik Lui, Mike F. Chang | 2011-11-29 |
| 7951651 | Dual flat non-leaded semiconductor package | Kai Liu, Xiaotian Zhang, Ming Sun | 2011-05-31 |
| 7897438 | Method of making semiconductor package with plated connection | Kai Liu, Ming Sun, Xiao Zhang | 2011-03-01 |