Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067822 | Integrated circuit package for semiconductor devices with improved electric resistance and inductance | Leeshawn Luo, Anup Bhalla, Sik Lui, Mike F. Chang | 2011-11-29 |
| 8058727 | Standing chip scale package | Tao Feng, Anup Bhalla | 2011-11-15 |
| 8053891 | Standing chip scale package | Tao Feng, Anup Bhalla | 2011-11-08 |
| 7955893 | Wafer level chip scale package and process of manufacture | Tao Feng, Francois Hebert, Ming Sun | 2011-06-07 |