Issued Patents 2011
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058961 | Lead frame-based discrete power inductor | Francois Hebert, Xiaotian Zhang, Jun Lu | 2011-11-15 |
| 8058727 | Standing chip scale package | Anup Bhalla, Yueh-Se Ho | 2011-11-15 |
| 8053891 | Standing chip scale package | Anup Bhalla, Yueh-Se Ho | 2011-11-08 |
| 8048775 | Process of forming ultra thin wafers having an edge support ring | Sung-Shan Tai | 2011-11-01 |
| 7977740 | Configuration of high-voltage semiconductor power device to achieve three dimensional charge coupling | Francois Hebert | 2011-07-12 |
| 7971340 | Planar grooved power inductor structure and method | Francois Hebert, Jun Lu | 2011-07-05 |
| 7955893 | Wafer level chip scale package and process of manufacture | Francois Hebert, Ming Sun, Yueh-Se Ho | 2011-06-07 |
| 7948346 | Planar grooved power inductor structure and method | Francois Hebert, Jun Lu | 2011-05-24 |
| 7884696 | Lead frame-based discrete power inductor | Francois Hebert, Xiaotian Zhang, Jun Lu | 2011-02-08 |
| 7884452 | Semiconductor power device package having a lead frame-based integrated inductor | Xiaotian Zhang, Francois Hebert | 2011-02-08 |
| 7868431 | Compact power semiconductor package and method with stacked inductor and integrated circuit die | Xiaotian Zhang, Francois Hebert, Ming Sun | 2011-01-11 |