Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058961 | Lead frame-based discrete power inductor | Francois Hebert, Tao Feng, Jun Lu | 2011-11-15 |
| 8049315 | Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package | Jun Lu, Anup Bhalla, Xiaobin Wang, Allen Timothy Chang, Kenny Hu | 2011-11-01 |
| 7951651 | Dual flat non-leaded semiconductor package | Kai Liu, Ming Sun, Leeshawn Luo | 2011-05-31 |
| 7898092 | Stacked-die package for battery power management | Jun Lu, Allen Timothy Chang | 2011-03-01 |
| 7884696 | Lead frame-based discrete power inductor | Francois Hebert, Tao Feng, Jun Lu | 2011-02-08 |
| 7884454 | Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package | Jun Lu, Anup Bhalla, Xiaobin Wang, Allen Timothy Chang, Man Sheng Hu | 2011-02-08 |
| 7884452 | Semiconductor power device package having a lead frame-based integrated inductor | Tao Feng, Francois Hebert | 2011-02-08 |
| 7868431 | Compact power semiconductor package and method with stacked inductor and integrated circuit die | Tao Feng, Francois Hebert, Ming Sun | 2011-01-11 |