Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076183 | Method of attaching an interconnection plate to a semiconductor die within a leadframe package | Yan Xun Xue, Le Shi, Liang Zhao | 2011-12-13 |
| 8058961 | Lead frame-based discrete power inductor | Francois Hebert, Tao Feng, Xiaotian Zhang | 2011-11-15 |
| 8049315 | Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package | Anup Bhalla, Xiaobin Wang, Allen Timothy Chang, Kenny Hu, Xiaotian Zhang | 2011-11-01 |
| 7971340 | Planar grooved power inductor structure and method | Francois Hebert, Tao Feng | 2011-07-05 |
| 7948346 | Planar grooved power inductor structure and method | Francois Hebert, Tao Feng | 2011-05-24 |
| 7939370 | Power semiconductor package | Francois Hebert | 2011-05-10 |
| 7898092 | Stacked-die package for battery power management | Allen Timothy Chang, Xiaotian Zhang | 2011-03-01 |
| 7884454 | Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package | Anup Bhalla, Xiaobin Wang, Allen Timothy Chang, Man Sheng Hu, Xiaotian Zhang | 2011-02-08 |
| 7884696 | Lead frame-based discrete power inductor | Francois Hebert, Tao Feng, Xiaotian Zhang | 2011-02-08 |