Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076183 | Method of attaching an interconnection plate to a semiconductor die within a leadframe package | Jun Lu, Le Shi, Liang Zhao | 2011-12-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076183 | Method of attaching an interconnection plate to a semiconductor die within a leadframe package | Jun Lu, Le Shi, Liang Zhao | 2011-12-13 |