Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076183 | Method of attaching an interconnection plate to a semiconductor die within a leadframe package | Yan Xun Xue, Jun Lu, Le Shi | 2011-12-13 |
| 7943424 | Encapsulation method for packaging semiconductor components with external leads | Limin Wang, Lei Shi, Feng Ye | 2011-05-17 |