Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989356 | Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability | Xusheng Bao, Yaojian Lin | 2011-08-02 |
| 7863726 | Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof | Seng Guan Chow | 2011-01-04 |