Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008770 | Integrated circuit package system with bump pad | Yaojian Lin, Romeo Emmanuel P. Alvarez, Haijing Cao | 2011-08-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008770 | Integrated circuit package system with bump pad | Yaojian Lin, Romeo Emmanuel P. Alvarez, Haijing Cao | 2011-08-30 |