Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026593 | Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof | Yaojian Lin, Qing Zhang | 2011-09-27 |
| 8008770 | Integrated circuit package system with bump pad | Yaojian Lin, Romeo Emmanuel P. Alvarez, Wan Lay Looi | 2011-08-30 |
| 7993972 | Wafer level die integration and method therefor | Yaojian Lin | 2011-08-09 |
| 7935570 | Semiconductor device and method of embedding integrated passive devices into the package electrically interconnected using conductive pillars | Yaojian Lin, Jianmin Fang, Kang Chen | 2011-05-03 |