Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026593 | Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof | Yaojian Lin, Haijing Cao | 2011-09-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026593 | Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof | Yaojian Lin, Haijing Cao | 2011-09-27 |