Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067272 | Integrated circuit package system for package stacking and manufacturing method thereof | Young Cheol Kim, Koo Hong Lee, Jae Hak Yee | 2011-11-29 |
| 8004095 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | Yaojian Lin, Seng Guan Chow | 2011-08-23 |
| 7986032 | Semiconductor package system with substrate having different bondable heights at lead finger tips | Seng Guan Chow, Ming Ying, Lip Seng Tan | 2011-07-26 |