Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067272 | Integrated circuit package system for package stacking and manufacturing method thereof | Koo Hong Lee, Jae Hak Yee, II Kwon Shim | 2011-11-29 |
| 8012867 | Wafer level chip scale package system | Koo Hong Lee, Il Kwon Shim, Bongsuk Choi | 2011-09-06 |
| 7985623 | Integrated circuit package system with contoured encapsulation | Choong Bin Yim | 2011-07-26 |
| 7915738 | Stackable multi-chip package system with support structure | Koo Hong Lee, Jae Hak Yee | 2011-03-29 |