Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067272 | Integrated circuit package system for package stacking and manufacturing method thereof | Young Cheol Kim, Jae Hak Yee, II Kwon Shim | 2011-11-29 |
| 8026582 | Integrated circuit package system with internal stacking module adhesive | Myung Kil Lee, Jae-Chang Kim | 2011-09-27 |
| 8012867 | Wafer level chip scale package system | Il Kwon Shim, Young Cheol Kim, Bongsuk Choi | 2011-09-06 |
| 7947535 | Thin package system with external terminals | Youngcheol Kim, Myung Kil Lee, Gwang Kim | 2011-05-24 |
| 7915724 | Integrated circuit packaging system with base structure device | Jong-Woo Ha, Soo Won Lee, Juhyun Park, Zigmund Ramirez Camacho, Jeffrey D. Punzalan +2 more | 2011-03-29 |
| 7915738 | Stackable multi-chip package system with support structure | Young Cheol Kim, Jae Hak Yee | 2011-03-29 |