Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067272 | Integrated circuit package system for package stacking and manufacturing method thereof | Young Cheol Kim, Koo Hong Lee, II Kwon Shim | 2011-11-29 |
| 8018039 | Integrated circuit package system with stacked devices | Frederick Cruz Santos, Yong Yong Xia, Jun Xu | 2011-09-13 |
| 7968981 | Inline integrated circuit system | Junwoo Myung, Byoung Wook Jang, YoungChul Kim | 2011-06-28 |
| 7915738 | Stackable multi-chip package system with support structure | Young Cheol Kim, Koo Hong Lee | 2011-03-29 |