Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7994625 | Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof | DaeSik Choi, DeokKyung Yang, Jong-Woo Ha, JaeSick Bae, Seung-Won Kim | 2011-08-09 |
| 7968981 | Inline integrated circuit system | Jae Hak Yee, Junwoo Myung, YoungChul Kim | 2011-06-28 |
| 7871861 | Stacked integrated circuit package system with intra-stack encapsulation | Sungmin Song, Junwoo Myung | 2011-01-18 |
| 7863737 | Integrated circuit package system with wire bond pattern | Hun Teak Lee, Kwang Soon Hwang | 2011-01-04 |