Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067306 | Integrated circuit packaging system with exposed conductor and method of manufacture thereof | SeungYun Ahn | 2011-11-29 |
| 8063475 | Semiconductor package system with through silicon via interposer | DaeSik Choi, Seung-Won Kim | 2011-11-22 |
| 7994625 | Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof | DaeSik Choi, Jong-Woo Ha, Byoung Wook Jang, JaeSick Bae, Seung-Won Kim | 2011-08-09 |
| 7875967 | Integrated circuit with step molded inner stacking module package in package system | In Sang Yoon, Jae Han Chung | 2011-01-25 |