Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7994625 | Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof | DaeSik Choi, DeokKyung Yang, Jong-Woo Ha, Byoung Wook Jang, Seung-Won Kim | 2011-08-09 |