Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067831 | Integrated circuit package system with planar interconnects | Hyeog Chan Kwon, Tae Sung Jeong, Taeg Ki Lim, Jong Wook Ju | 2011-11-29 |
| 7875967 | Integrated circuit with step molded inner stacking module package in package system | DeokKyung Yang, In Sang Yoon | 2011-01-25 |