Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080446 | Integrated circuit packaging system with interposer interconnections and method of manufacture thereof | A Leam Choi, Kenny Lee, HanGil Shin | 2011-12-20 |
| 8035210 | Integrated circuit package system with interposer | JoungIn Yang, Dongjin Jung | 2011-10-11 |
| 7875967 | Integrated circuit with step molded inner stacking module package in package system | DeokKyung Yang, Jae Han Chung | 2011-01-25 |