Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080446 | Integrated circuit packaging system with interposer interconnections and method of manufacture thereof | A Leam Choi, Kenny Lee, In Sang Yoon | 2011-12-20 |
| 8039316 | Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof | HeeJo Chi, Soo Jung Park | 2011-10-18 |
| 8018034 | Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure | HeeJo Chi, NamJu Cho | 2011-09-13 |
| 7928552 | Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereof | NamJu Cho, HeeJo Chi | 2011-04-19 |
| 7863735 | Integrated circuit packaging system with a tiered substrate package and method of manufacture thereof | NamJu Cho, HeeJo Chi | 2011-01-04 |