Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080446 | Integrated circuit packaging system with interposer interconnections and method of manufacture thereof | Kenny Lee, In Sang Yoon, HanGil Shin | 2011-12-20 |
| 8008787 | Integrated circuit package system with delamination prevention structure | DongSam Park, Keon Teak Kang | 2011-08-30 |