Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008787 | Integrated circuit package system with delamination prevention structure | A Leam Choi, Keon Teak Kang | 2011-08-30 |
| 7989950 | Integrated circuit packaging system having a cavity | Dongjin Jung | 2011-08-02 |
| 7986048 | Package-on-package system with through vias and method of manufacture thereof | JoungIn Yang | 2011-07-26 |
| 7863100 | Integrated circuit packaging system with layered packaging and method of manufacture thereof | Joungln Yang, Dongjin Jung | 2011-01-04 |