Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035210 | Integrated circuit package system with interposer | Dongjin Jung, In Sang Yoon | 2011-10-11 |
| 7986048 | Package-on-package system with through vias and method of manufacture thereof | DongSam Park | 2011-07-26 |
| 7901987 | Package-on-package system with internal stacking module interposer | Dongjin Jung | 2011-03-08 |