Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035210 | Integrated circuit package system with interposer | JoungIn Yang, In Sang Yoon | 2011-10-11 |
| 7989950 | Integrated circuit packaging system having a cavity | DongSam Park | 2011-08-02 |
| 7901987 | Package-on-package system with internal stacking module interposer | JoungIn Yang | 2011-03-08 |
| 7863100 | Integrated circuit packaging system with layered packaging and method of manufacture thereof | Joungln Yang, DongSam Park | 2011-01-04 |