Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863100 | Integrated circuit packaging system with layered packaging and method of manufacture thereof | Dongjin Jung, DongSam Park | 2011-01-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863100 | Integrated circuit packaging system with layered packaging and method of manufacture thereof | Dongjin Jung, DongSam Park | 2011-01-04 |