Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067275 | Integrated circuit package system with package integration | WonJun Ko, Jong Wook Ju, SeungYong Chai, Ja Eun Yun | 2011-11-29 |
| 8067831 | Integrated circuit package system with planar interconnects | Hyeog Chan Kwon, Tae Sung Jeong, Jae Han Chung, Jong Wook Ju | 2011-11-29 |
| 7969023 | Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof | JaEun Yun, Byung Joon Han | 2011-06-28 |