Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7969023 | Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof | Taeg Ki Lim, Byung Joon Han | 2011-06-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7969023 | Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof | Taeg Ki Lim, Byung Joon Han | 2011-06-28 |