Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067831 | Integrated circuit package system with planar interconnects | Tae Sung Jeong, Jae Han Chung, Taeg Ki Lim, Jong Wook Ju | 2011-11-29 |
| 8049322 | Integrated circuit package-in-package system and method for making thereof | Choong Bin Yim, Jong-Woo Ha | 2011-11-01 |
| 8030134 | Stacked semiconductor package having adhesive/spacer structure and insulation | Marcos Karnezos | 2011-10-04 |
| 7975377 | Wafer scale heat slug system | — | 2011-07-12 |
| 7932593 | Multipackage module having stacked packages with asymmetrically arranged die and molding | — | 2011-04-26 |
| 7884460 | Integrated circuit packaging system with carrier and method of manufacture thereof | Choong Bin Yim, Jong-Woo Ha | 2011-02-08 |
| 7875966 | Stacked integrated circuit and package system | Tae Sung Jeong, Youngcheol Kim | 2011-01-25 |