Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049322 | Integrated circuit package-in-package system and method for making thereof | Hyeog Chan Kwon, Jong-Woo Ha | 2011-11-01 |
| 7999368 | Semiconductor package having ink-jet type dam and method of manufacturing the same | Tae-Je Cho | 2011-08-16 |
| 7985623 | Integrated circuit package system with contoured encapsulation | Young Cheol Kim | 2011-07-26 |
| 7884460 | Integrated circuit packaging system with carrier and method of manufacture thereof | Hyeog Chan Kwon, Jong-Woo Ha | 2011-02-08 |