Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7999368 | Semiconductor package having ink-jet type dam and method of manufacturing the same | Choong Bin Yim | 2011-08-16 |
| 7928435 | Interposer chip and multi-chip package having the interposer chip | Sung Yong Park, Tae Hun Kim, Jong Kook Kim, Byeong-Yeon Cho | 2011-04-19 |
| 7884392 | Image sensor having through via | Hyuek Jae Lee, Yong-Hwan Kwon, Un-Byoung Kang, Chung-Sun Lee, Woon-Seong Kwon +1 more | 2011-02-08 |