Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7986047 | Wire bond interconnection | Hun Teak Lee, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse | 2011-07-26 |
| 7928435 | Interposer chip and multi-chip package having the interposer chip | Sung Yong Park, Tae-Je Cho, Tae Hun Kim, Byeong-Yeon Cho | 2011-04-19 |
| 7909233 | Method of manufacturing a semiconductor package with fine pitch lead fingers | Hun Teak Lee, ChulSik Kim, Ki Youn Jang | 2011-03-22 |