Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7986047 | Wire bond interconnection | Jong Kook Kim, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse | 2011-07-26 |
| 7909233 | Method of manufacturing a semiconductor package with fine pitch lead fingers | Jong Kook Kim, ChulSik Kim, Ki Youn Jang | 2011-03-22 |
| 7863737 | Integrated circuit package system with wire bond pattern | Byoung Wook Jang, Kwang Soon Hwang | 2011-01-04 |