Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863737 | Integrated circuit package system with wire bond pattern | Byoung Wook Jang, Hun Teak Lee | 2011-01-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863737 | Integrated circuit package system with wire bond pattern | Byoung Wook Jang, Hun Teak Lee | 2011-01-04 |