Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7986047 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Ki Youn Jang, Rajendra D. Pendse | 2011-07-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7986047 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Ki Youn Jang, Rajendra D. Pendse | 2011-07-26 |