Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067275 | Integrated circuit package system with package integration | WonJun Ko, SeungYong Chai, Taeg Ki Lim, Ja Eun Yun | 2011-11-29 |
| 8067831 | Integrated circuit package system with planar interconnects | Hyeog Chan Kwon, Tae Sung Jeong, Jae Han Chung, Taeg Ki Lim | 2011-11-29 |